Invention Grant
- Patent Title: Systems for integrated decomposition and scanning of a semiconducting wafer
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Application No.: US16200010Application Date: 2018-11-26
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Publication No.: US11705351B2Publication Date: 2023-07-18
- Inventor: Tyler Yost , Daniel R. Wiederin , Beau Marth , Jared Kaser , Jonathan Hein , Jae Seok Lee , Jae Min Kim , Stephen H. Sudyka
- Applicant: Elemental Scientific, Inc.
- Applicant Address: US NE Omaha
- Assignee: Elemental Scientific, Inc.
- Current Assignee: Elemental Scientific, Inc.
- Current Assignee Address: US NE Omaha
- Agency: Advent, LLP
- Agent Kevin E. West
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; H01L21/66 ; H01J49/10 ; G01N21/73 ; H01J49/00 ; G01N33/00
Abstract:
Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
Public/Granted literature
- US20190172729A1 SYSTEMS FOR INTEGRATED DECOMPOSITION AND SCANNING OF A SEMICONDUCTING WAFER Public/Granted day:2019-06-06
Information query
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