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公开(公告)号：US20230395406A1
公开(公告)日：2023-12-07
申请号：US18320748
申请日：2023-05-19
Applicant: Elemental Scientific, Inc.
Inventor： Tyler Yost , Daniel R. Wiederin , Beau A. Marth , Jared Kaser , Jonathan Hein , Jae Seok Lee , Jae Min Kim , Stephen H. Sudyka
IPC: H01L21/67 , H01L21/66 , H01L21/677 , H01J49/10 , G01N21/73
CPC classification number: H01L21/6719 , H01L21/67126 , H01L22/34 , H01L21/67772 , H01J49/105 , H01L21/67748 , H01L21/67051 , H01L21/67259 , H01L21/6708 , G01N21/73 , H01L22/14 , H01L21/6715 , H01L22/12 , H01J49/00
Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
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公开(公告)号：US11476134B2
公开(公告)日：2022-10-18
申请号：US17361943
申请日：2021-06-29
Applicant: Elemental Scientific, Inc.
Inventor： Tyler Yost , Daniel R. Wiederin , Beau Marth , Jared Kaser , Jonathan Hein , Jae Seok Lee , Jae Min Kim , Stephen H. Sudyka
Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
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公开(公告)号：US20240006201A1
公开(公告)日：2024-01-04
申请号：US18327226
申请日：2023-06-01
Applicant: Elemental Scientific, Inc.
Inventor： Tyler Yost , Daniel R. Wiederin , Beau A. Marth , Jared Kaser , Jonathan Hein , Jae Seok Lee , Jae Min Kim , Stephen H. Sudyka
IPC: H01L21/67 , H01L21/66 , H01L21/677 , H01J49/10 , G01N21/73
CPC classification number: H01L21/6719 , H01L21/67126 , H01L22/34 , H01L21/67772 , H01J49/105 , H01L21/67748 , H01L21/67051 , H01L21/67259 , H01L21/6708 , G01N21/73 , H01L22/14 , H01L21/6715 , H01L22/12 , H01J49/00
Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
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公开(公告)号：US11804390B2
公开(公告)日：2023-10-31
申请号：US17562411
申请日：2021-12-27
Applicant: Elemental Scientific, Inc.
Inventor： Tyler Yost , Daniel R. Wiederin , Beau Marth , Jared Kaser , Jonathan Hein , Jae Seok Lee , Jae Min Kim , Stephen H. Sudyka
CPC classification number: H01L21/6719 , G01N21/73 , H01J49/105 , H01L21/6708 , H01L21/6715 , H01L21/67051 , H01L21/67126 , H01L21/67259 , H01L21/67748 , H01L21/67772 , H01L22/14 , H01L22/34 , G01N2033/0095 , H01J49/00 , H01L22/12
Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
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公开(公告)号：US20230111929A1
公开(公告)日：2023-04-13
申请号：US17968124
申请日：2022-10-18
Applicant: Elemental Scientific, Inc.
Inventor： Tyler Yost , Daniel R. Wiederin , Beau A. Marth , Jared Kaser , Jonathan Hein , Jae Seok Lee , Jae Min Kim , Stephen H. Sudyka
IPC: H01L21/67 , H01L21/66 , H01L21/677 , H01J49/10 , G01N21/73
Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
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Patent Agency Ranking
公开(公告)号：US20210384047A1
公开(公告)日：2021-12-09
申请号：US17361943
申请日：2021-06-29
Applicant: Elemental Scientific, Inc.
Inventor： Tyler Yost , Daniel R. Wiederin , Beau Marth , Jared Kaser , Jonathan Hein , Jae Seok Lee , Jae Min Kim , Stephen H. Sudyka
IPC: H01L21/67 , H01L21/66 , H01L21/677 , H01J49/10 , G01N21/73
Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
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公开(公告)号：US11049741B2
公开(公告)日：2021-06-29
申请号：US16200074
申请日：2018-11-26
Applicant: Elemental Scientific, Inc.
Inventor： Tyler Yost , Daniel R. Wiederin , Beau Marth , Jared Kaser , Jonathan Hein , Jae Seok Lee , Jae Min Kim , Stephen H. Sudyka
Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
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公开(公告)号：US20190172730A1
公开(公告)日：2019-06-06
申请号：US16200038
申请日：2018-11-26
Applicant: Elemental Scientific, Inc.
Inventor： Tyler Yost , Daniel R. Wiederin , Beau Marth , Jared Kaser , Jonathan Hein , Jae Seok Lee , Jae Min Kim , Stephen H. Sudyka
IPC: H01L21/67 , H01L21/677 , H01J49/10 , H01L21/66
Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
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公开(公告)号：US20190172729A1
公开(公告)日：2019-06-06
申请号：US16200010
申请日：2018-11-26
Applicant: Elemental Scientific, Inc.
Inventor： Tyler Yost , Daniel R. Wiederin , Beau Marth , Jared Kaser , Jonathan Hein , Jae Seok Lee , Jae Min Kim , Stephen H. Sudyka
Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
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公开(公告)号：US11694914B2
公开(公告)日：2023-07-04
申请号：US17968124
申请日：2022-10-18
Applicant: Elemental Scientific, Inc.
Inventor： Tyler Yost , Daniel R. Wiederin , Beau A. Marth , Jared Kaser , Jonathan Hein , Jae Seok Lee , Jae Min Kim , Stephen H. Sudyka
CPC classification number: H01L21/6719 , G01N21/73 , H01J49/105 , H01L21/6708 , H01L21/6715 , H01L21/67051 , H01L21/67126 , H01L21/67259 , H01L21/67748 , H01L21/67772 , H01L22/14 , H01L22/34 , G01N2033/0095 , H01J49/00 , H01L22/12
Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
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