Invention Grant
- Patent Title: Methods of micro-via formation for advanced packaging
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Application No.: US17323381Application Date: 2021-05-18
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Publication No.: US11705365B2Publication Date: 2023-07-18
- Inventor: Wei-Sheng Lei , Kurtis Leschkies , Roman Gouk , Giback Park , Kyuil Cho , Tapash Chakraborty , Han-Wen Chen , Steven Verhaverbeke
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/48
Abstract:
The present disclosure relates to micro-via structures for interconnects in advanced wafer level semiconductor packaging. The methods described herein enable the formation of high-quality, low-aspect-ratio micro-via structures with improved uniformity, thus facilitating thin and small-form-factor semiconductor devices having high I/O density with improved bandwidth and power.
Public/Granted literature
- US20220375787A1 METHODS OF MICRO-VIA FORMATION FOR ADVANCED PACKAGING Public/Granted day:2022-11-24
Information query
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