Invention Grant
- Patent Title: Substrate treating apparatus and inkjet apparatus
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Application No.: US17407936Application Date: 2021-08-20
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Publication No.: US11707944B2Publication Date: 2023-07-25
- Inventor: Jun Seok Lee , Yoon-Ok Jang , Sung Ho Kim , Kwang Jun Choi , Hyun Min Lee
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-Do
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Priority: KR 20200104300 2020.08.20
- Main IPC: B41M1/34
- IPC: B41M1/34 ; B41J2/165 ; B41M7/00

Abstract:
Disclosed is a substrate treating apparatus. The substrate treating apparatus may include a stage including an accommodation area, onto or from which a substrate is loaded or unloaded, and a treatment area, in which the substrate is treated, a liquid discharge head that supplies a treatment liquid to the substrate, and a liquid receiving part that receives the treatment liquid pre-discharged by the liquid discharge head in the treatment area.
Public/Granted literature
- US20220055391A1 SUBSTRATE TREATING APPARATUS AND INKJET APPARATUS Public/Granted day:2022-02-24
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