Invention Grant
- Patent Title: System comprising packaged optical devices
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Application No.: US17144938Application Date: 2021-01-08
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Publication No.: US11722220B2Publication Date: 2023-08-08
- Inventor: Chang-Yu Lin , Cheng-Yuan Kung , Hung-Yi Lin
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H04B10/00
- IPC: H04B10/00 ; H04B10/40 ; G02B6/42 ; H04J14/00

Abstract:
A system including optical devices is provided. The system includes a first substrate and a first device for optical communication. The first device has a first surface, a second surface opposite to the first surface, and a first side contiguous with the first surface and the second surface. Moreover, the first side is smaller than one of the first surface and the second surface in terms of area. The first device is attached at the first side thereof to the first substrate.
Public/Granted literature
- US20210167856A1 SYSTEM COMPRISING PACKAGED OPTICAL DEVICES Public/Granted day:2021-06-03
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