- 专利标题: Magnetic material having coated ferromagnetic filler particles
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申请号: US17482861申请日: 2021-09-23
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公开(公告)号: US11728077B2公开(公告)日: 2023-08-15
- 发明人: Brandon C. Marin , Frank Truong , Shivasubramanian Balasubramanian
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Essential Patents Group, LLP
- 主分类号: H01F1/20
- IPC分类号: H01F1/20 ; H01F27/28 ; H01L23/00 ; H01L23/64 ; H01L23/498 ; H01F17/00
摘要:
A magnetic material may be fabricated with a plurality of magnetic filler particles dispersed within a carrier material, wherein at last one of the magnetic filler particles may comprise a ferromagnetic core coated with an inert material to form a shell surrounding the ferromagnetic core. Such a coating may allow for the use of ferromagnetic materials for forming embedded inductors in package substrates without the risk of being incompatible with fabrication processes used to form these package substrates.
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