Invention Grant
- Patent Title: Semiconductor package with heat dissipation films and manufacturing method thereof
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Application No.: US16524172Application Date: 2019-07-29
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Publication No.: US11728238B2Publication Date: 2023-08-15
- Inventor: Ting-Yu Yeh , Cing-He Chen , Kuo-Chiang Ting , Weiming Chris Chen , Chia-Hao Hsu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L21/56 ; H01L23/31 ; H01L23/00 ; H01L23/367
Abstract:
A semiconductor package includes a redistribution structure, at least one semiconductor device and a plurality of heat dissipation films. The at least one semiconductor device is mounted on the redistribution structure. The plurality of heat dissipation films are disposed on the at least one semiconductor device in a side by side manner and jointly cover an upper surface of the at least one semiconductor device. A manufacturing method of the semiconductor package is also provided.
Public/Granted literature
- US20210035884A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-02-04
Information query
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