公开(公告)号：US20210035884A1

公开(公告)日：2021-02-04

申请号：US16524172

申请日：2019-07-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ting-Yu Yeh ,  Cing-He Chen ,  Kuo-Chiang Ting ,  Weiming Chris Chen ,  Chia-Hao Hsu

IPC: H01L23/373 ,  H01L21/56 ,  H01L23/31 ,  H01L23/367 ,  H01L23/00

Abstract: A semiconductor package includes a redistribution structure, at least one semiconductor device and a plurality of heat dissipation films. The at least one semiconductor device is mounted on the redistribution structure. The plurality of heat dissipation films are disposed on the at least one semiconductor device in a side by side manner and jointly cover an upper surface of the at least one semiconductor device. A manufacturing method of the semiconductor package is also provided.

公开(公告)号：US11728238B2

公开(公告)日：2023-08-15

申请号：US16524172

申请日：2019-07-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ting-Yu Yeh ,  Cing-He Chen ,  Kuo-Chiang Ting ,  Weiming Chris Chen ,  Chia-Hao Hsu

IPC: H01L23/373 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/367

CPC classification number: H01L23/3735 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/367 ,  H01L24/09 ,  H01L2224/02372 ,  H01L2924/3511

Abstract: A semiconductor package includes a redistribution structure, at least one semiconductor device and a plurality of heat dissipation films. The at least one semiconductor device is mounted on the redistribution structure. The plurality of heat dissipation films are disposed on the at least one semiconductor device in a side by side manner and jointly cover an upper surface of the at least one semiconductor device. A manufacturing method of the semiconductor package is also provided.