Invention Grant
- Patent Title: Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component
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Application No.: US17166430Application Date: 2021-02-03
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Publication No.: US11728293B2Publication Date: 2023-08-15
- Inventor: Changhan Hobie Yun , Daniel Daeik Kim , Paragkumar Ajaybhai Thadesar , Nosun Park , Sameer Sunil Vadhavkar
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: W&T
- Main IPC: H01L23/64
- IPC: H01L23/64 ; H01L23/66 ; H01L49/02

Abstract:
Mobile phones and other mobile devices communicate wirelessly by transmitting and receiving RF signals. Transmitters and receivers in wireless devices process RF signals in certain frequency ranges or bands. Signals in other frequencies can be blocked or filtered out by, for example, a lumped-element circuit or a lumped-element filter consisting of passive electrical components such as inductors, capacitors, and resistors. A passive component device, or integrated passive device, is one example of a lumped-element filter fabricated with passive components on a die. In a mobile device, a passive component device and one or more integrated circuits or other chips used for signal processing are interconnected by being mounted on (i.e., coupled to) a metallization structure or package substrate in a chip module or multi-chip module. The demand for miniaturization of hand-held mobile devices drives a need for reducing the sizes of chip modules that are inside a mobile device.
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Information query
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