公开(公告)号：US20170207293A1

公开(公告)日：2017-07-20

申请号：US15002138

申请日：2016-01-20

Applicant: QUALCOMM Incorporated

Inventor： Young Kyu Song ,  Sangjo Choi ,  Jong-Hoon Lee ,  Paragkumar Ajaybhai Thadesar

IPC: H01L49/02 ,  G05B15/02 ,  H01F29/02 ,  H01L27/06 ,  H01L23/522

Abstract: Some features pertain to a device package that includes a die and a package substrate. The die includes a first switch. The package substrate is coupled to the die. The package substrate includes at least one dielectric layer, a primary inductor, and a first secondary inductor coupled to the first switch of the die. The first secondary inductor and the first switch are coupled to a plurality of interconnects configured to provide an electrical path for a reference ground signal. The primary inductor is configurable to have different inductances by opening and closing the first switch coupled to the first secondary inductor. In some implementations, the primary inductor is configurable in real time while the die is operational. In some implementations, the die further includes a second switch, and the package substrate further includes a second secondary inductor coupled to the second switch of the die.

公开(公告)号：US12016247B2

公开(公告)日：2024-06-18

申请号：US17005168

申请日：2020-08-27

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie Yun ,  Nosun Park ,  Daniel Daeik Kim ,  Paragkumar Ajaybhai Thadesar ,  Sameer Sunil Vadhavkar

IPC: H10N30/00 ,  H03H9/02

CPC classification number: H10N30/1051 ,  H03H9/02015 ,  H03H9/02535

Abstract: A package that includes an integrated device, an integrated passive device and a void. The integrated device is configured as a filter. The integrated device includes a substrate comprising a piezoelectric material, and at least one metal layer coupled to a first surface of the first substrate. The integrated passive device is coupled to the integrated device. The integrated passive device is configured as a cap for the integrated device. The void is located between the integrated device and the integrated passive device.

公开(公告)号：US11502652B2

公开(公告)日：2022-11-15

申请号：US16870383

申请日：2020-05-08

Applicant: QUALCOMM Incorporated

Inventor： Daniel Daeik Kim ,  Paragkumar Ajaybhai Thadesar ,  Changhan Hobie Yun ,  Sameer Sunil Vadhavkar ,  Nosun Park

IPC: H03F3/14 ,  H03F3/213 ,  H01L23/34 ,  H01L23/66 ,  H03F1/56 ,  H03F3/195

Abstract: A device that includes a substrate and a power amplifier coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects, and a capacitor configured to operate as an output match element, where the capacitor is defined by a plurality of capacitor interconnects. The power amplifier is coupled to the capacitor. The capacitor is configured to operate as an output match element for the power amplifier. The substrate includes an inductor coupled to the capacitor, where the inductor is defined by at least one inductor interconnect. The capacitor and the inductor are configured to operate as a resonant trap or an output match element.

公开(公告)号：US12027476B2

公开(公告)日：2024-07-02

申请号：US17575492

申请日：2022-01-13

Applicant: QUALCOMM Incorporated

Inventor： Fnu Suraj Prakash ,  Paragkumar Ajaybhai Thadesar ,  John Jong-Hoon Lee ,  Nikhil Raman ,  Peng Song ,  Francesco Carrara

IPC: H01L23/64 ,  H01F27/28 ,  H01L23/528 ,  H01L49/02 ,  H05K1/16

CPC classification number: H01L23/645 ,  H01F27/2804 ,  H01L23/528 ,  H01L28/10 ,  H05K1/165

Abstract: A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, and a second integrated device coupled to a second surface of the substrate. The substrate includes a dielectric layer and a plurality of interconnects. The plurality of interconnects includes a first plurality of interconnects configured as a first inductor and a second plurality of interconnects configured as a second inductor. The first integrated device is configured to be coupled to the first inductor. The second integrated device is configured to be coupled to the second inductor. The second integrated device is configured to tune the first inductor through the second inductor.

公开(公告)号：US20220246552A1

公开(公告)日：2022-08-04

申请号：US17166430

申请日：2021-02-03

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie Yun ,  Daniel Daeik Kim ,  Paragkumar Ajaybhai Thadesar ,  Nosun Park ,  Sameer Sunil Vadhavkar

IPC: H01L23/66 ,  H01L23/64 ,  H01L49/02

Abstract: Mobile phones and other mobile devices communicate wirelessly by transmitting and receiving RF signals. Transmitters and receivers in wireless devices process RF signals in certain frequency ranges or bands. Signals in other frequencies can be blocked or filtered out by, for example, a lumped-element circuit or a lumped-element filter consisting of passive electrical components such as inductors, capacitors, and resistors. A passive component device, or integrated passive device, is one example of a lumped-element filter fabricated with passive components on a die. In a mobile device, a passive component device and one or more integrated circuits or other chips used for signal processing are interconnected by being mounted on (i.e., coupled to) a metallization structure or package substrate in a chip module or multi-chip module. The demand for miniaturization of hand-held mobile devices drives a need for reducing the sizes of chip modules that are inside a mobile device.

公开(公告)号：US11239158B1

公开(公告)日：2022-02-01

申请号：US17066154

申请日：2020-10-08

Applicant: QUALCOMM Incorporated

Inventor： Paragkumar Ajaybhai Thadesar ,  Changhan Hobie Yun ,  Sameer Sunil Vadhavkar ,  Daniel Daeik Kim ,  Francesco Carrara

IPC: H01L23/522 ,  H01L23/66 ,  H01L23/00

Abstract: An integrated circuit (IC) package comprising a first die, including an active layer opposite a backside surface of the first die supporting a plurality of backside pads is provided. The IC package also incorporates a package substrate coupled to the active layer. The package pads on the package substrate correspond to the plurality of backside pads. A passive device comprising a plurality of wire bonds is coupled to the plurality of backside pads and the plurality of package pads. The passive device may also comprise a plurality of wire bonds coupled to the package pads by through silicon vias (TSVs). Multiple dies may be coupled with die-to-die wire bonds coupled to backside pads on each die.

公开(公告)号：US12009292B2

公开(公告)日：2024-06-11

申请号：US17547093

申请日：2021-12-09

Applicant: QUALCOMM Incorporated

Inventor： Nosun Park ,  Changhan Hobie Yun ,  Daniel Daeik Kim ,  Paragkumar Ajaybhai Thadesar ,  Sameer Sunil Vadhavkar

IPC: H01L23/522 ,  H01L49/02

CPC classification number: H01L23/5223 ,  H01L23/5227 ,  H01L28/10 ,  H01L28/40

Abstract: An integrated circuit (IC) includes a substrate and a first metal-insulator-metal (MIM) capacitor. The first MIM capacitor includes a first plate comprising a first metallization layer on a surface of the substrate. The first MIM capacitor also includes a first MIM insulator layer on a first portion of a surface of the first plate, a sidewall of the first plate, and a first portion of the surface of the substrate. The first MIM capacitor further includes a second plate on the first MIM insulator layer and on a second portion of the surface of the substrate, the second plate comprising a second metallization layer. The IC also includes an inductor comprising a portion of the second plate on the second portion of the surface of the substrate.

公开(公告)号：US11770115B2

公开(公告)日：2023-09-26

申请号：US17235131

申请日：2021-04-20

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie Yun ,  Hannu Laurila ,  Ville Lehtisalo ,  Ville Herman Brunou ,  Daniel Daeik Kim ,  Paragkumar Ajaybhai Thadesar ,  Nosun Park ,  Wei Cheng

IPC: H03J3/20 ,  H03H3/00 ,  H04B1/18 ,  H03H7/01

CPC classification number: H03J3/20 ,  H03H3/00 ,  H03H7/0123 ,  H04B1/18

Abstract: An exemplary tunable circuit includes an inductor coupled to a node and a first capacitor coupled to the node. The tunable circuit also includes a variable capacitor coupled to the node, such that a total capacitance of the tunable circuit depends on a fixed capacitance of the first capacitor and a variable capacitance of the variable capacitor. In an example, the inductor and the first capacitor are both included in a passive device and the variable capacitor is in a semiconductor device. The variable capacitor allows the total capacitance to be modified for the purpose of, for example, calibrating the capacitance to account for manufacturing variations, and/or adjusting to a frequency range of operation used by wireless devices in a region of the world. The first capacitor may be a higher quality capacitor providing a larger portion of the total capacitance than the variable capacitor.

公开(公告)号：US20220123735A1

公开(公告)日：2022-04-21

申请号：US17235131

申请日：2021-04-20

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie Yun ,  Hannu Laurila ,  Ville Lehtisalo ,  Ville Herman Brunou ,  Daniel Daeik Kim ,  Paragkumar Ajaybhai Thadesar ,  Nosun Park ,  Wei Cheng

IPC: H03J3/20 ,  H03H7/01 ,  H04B1/18 ,  H03H3/00

Abstract: An exemplary tunable circuit includes an inductor coupled to a node and a first capacitor coupled to the node. The tunable circuit also includes a variable capacitor coupled to the node, such that a total capacitance of the tunable circuit depends on a fixed capacitance of the first capacitor and a variable capacitance of the variable capacitor. In an example, the inductor and the first capacitor are both included in a passive device and the variable capacitor is in a semiconductor device. The variable capacitor allows the total capacitance to be modified for the purpose of, for example, calibrating the capacitance to account for manufacturing variations, and/or adjusting to a frequency range of operation used by wireless devices in a region of the world. The first capacitor may be a higher quality capacitor providing a larger portion of the total capacitance than the variable capacitor.

公开(公告)号：US11728293B2

公开(公告)日：2023-08-15

申请号：US17166430

申请日：2021-02-03

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie Yun ,  Daniel Daeik Kim ,  Paragkumar Ajaybhai Thadesar ,  Nosun Park ,  Sameer Sunil Vadhavkar

IPC: H01L23/64 ,  H01L23/66 ,  H01L49/02

CPC classification number: H01L23/66 ,  H01L23/645 ,  H01L28/10

Abstract: Mobile phones and other mobile devices communicate wirelessly by transmitting and receiving RF signals. Transmitters and receivers in wireless devices process RF signals in certain frequency ranges or bands. Signals in other frequencies can be blocked or filtered out by, for example, a lumped-element circuit or a lumped-element filter consisting of passive electrical components such as inductors, capacitors, and resistors. A passive component device, or integrated passive device, is one example of a lumped-element filter fabricated with passive components on a die. In a mobile device, a passive component device and one or more integrated circuits or other chips used for signal processing are interconnected by being mounted on (i.e., coupled to) a metallization structure or package substrate in a chip module or multi-chip module. The demand for miniaturization of hand-held mobile devices drives a need for reducing the sizes of chip modules that are inside a mobile device.