Invention Grant
- Patent Title: Surface-treated aggregated boron nitride powder, aggregated boron nitride powder, and thermally conductive resin composition
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Application No.: US17588757Application Date: 2022-01-31
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Publication No.: US11732173B2Publication Date: 2023-08-22
- Inventor: Go Takeda , Yoshitaka Taniguchi
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agent Manabu Kanesaka
- Priority: JP 16198961 2016.10.07 JP 16229343 2016.11.25
- The original application number of the division: US16339978
- Main IPC: C08K5/14
- IPC: C08K5/14 ; C09K5/14 ; C01B21/064 ; C08K3/38 ; C08K9/02 ; C08K9/04 ; C09C3/00 ; C09C3/04 ; C09C3/06 ; C09C3/08

Abstract:
A surface-treated aggregated boron nitride powder is prepared by using the boron nitride powder as the raw material, adding an oxidizer to the boron nitride aggregated grains, wet-pulverizing or wet-crushing the grains for surface modification treatment of the particles and allowing reaction of the particles with a metal coupling agent. The surface-treated boron nitride aggregated grains are formed by aggregation of hexagonal h-BN primary particles; (B) have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (C) have a crushing strength of 5 MPa or more; and (D) have an average particle diameter of 20 μm or more and 100 μm or less.
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