Invention Grant
- Patent Title: Systems and methods for improved semiconductor etching and component protection
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Application No.: US16707379Application Date: 2019-12-09
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Publication No.: US11735441B2Publication Date: 2023-08-22
- Inventor: Tien Fak Tan , Lok Kee Loh , Dmitry Lubomirsky , Soonwook Jung , Martin Yue Choy , Soonam Park
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67 ; H01L21/3065 ; H01L21/324

Abstract:
Semiconductor systems and methods may include a semiconductor processing chamber having a gas box defining an access to the semiconductor processing chamber. The chamber may include a spacer characterized by a first surface with which the gas box is coupled, and the spacer may define a recessed ledge on an interior portion of the first surface. The chamber may include a support bracket seated on the recessed ledge that extends along a second surface of the spacer. The chamber may also include a gas distribution plate seated on the support bracket.
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