Invention Grant
- Patent Title: Subframe structure with embedded control signaling
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Application No.: US17216386Application Date: 2021-03-29
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Publication No.: US11743894B2Publication Date: 2023-08-29
- Inventor: Krishna Kiran Mukkavilli , Jing Jiang , Tingfang Ji , Jamie Menjay Lin , Joseph Binamira Soriaga , John Edward Smee
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: QUALCOMM Incorporated
- Main IPC: H04W72/20
- IPC: H04W72/20 ; H04B7/0452 ; H04L5/00 ; H04W72/12 ; H04W72/56 ; H04W72/566

Abstract:
An apparatus may utilize an air interface to transmit and/or receive a transmission during a first TTI that includes a second set of data overriding a first set of data scheduled for transmission during the first TTI. The air interface may further be utilized to transmit and/or receive a transmission after a duration of time that is less than a total time duration of the first TTI that includes an override indicator that is at least partially embedded in a data portion of a subframe. The override indicator may be configured to indicate that the first set of data scheduled for transmission during the first TTI is overridden by the second set of data having the higher priority. The override indicator may be transmitted after the second set of data is transmitted. The one or more additional TTIs may be after the first TTI.
Public/Granted literature
- US20210219282A1 SUBFRAME STRUCTURE WITH EMBEDDED CONTROL SIGNALING Public/Granted day:2021-07-15
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