- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US17573595Application Date: 2022-01-11
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Publication No.: US11744024B2Publication Date: 2023-08-29
- Inventor: Ming-Hung Chen , Yung I Yeh , Chang-Lin Yeh , Sheng-Yu Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H05K5/00 ; H05K5/06 ; H05K1/18 ; H05K9/00 ; H05K3/28 ; H05K1/14
Abstract:
A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.
Public/Granted literature
- US20220141971A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-05-05
Information query
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