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公开(公告)号:US12089349B2
公开(公告)日:2024-09-10
申请号:US18239723
申请日:2023-08-29
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor: Ming-Hung Chen , Yung I Yeh , Chang-Lin Yeh , Sheng-Yu Chen
CPC classification number: H05K5/0017 , H05K1/142 , H05K1/144 , H05K1/181 , H05K3/284 , H05K5/065 , H05K9/0022 , H05K2201/041 , H05K2201/10037 , H05K2201/10128 , H05K2201/10151 , H05K2203/1316 , H05K2203/1327
Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.
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公开(公告)号:US11744024B2
公开(公告)日:2023-08-29
申请号:US17573595
申请日:2022-01-11
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor: Ming-Hung Chen , Yung I Yeh , Chang-Lin Yeh , Sheng-Yu Chen
CPC classification number: H05K5/0017 , H05K1/142 , H05K1/144 , H05K1/181 , H05K3/284 , H05K5/065 , H05K9/0022 , H05K2201/041 , H05K2201/10037 , H05K2201/10128 , H05K2201/10151 , H05K2203/1316 , H05K2203/1327
Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.
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