Invention Grant
- Patent Title: Methods of forming source/drain contacts in field-effect transistors
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Application No.: US17099304Application Date: 2020-11-16
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Publication No.: US11749725B2Publication Date: 2023-09-05
- Inventor: Sheng-Tsung Wang , Chia-Hao Chang , Yu-Ming Lin , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- The original application number of the division: US16386853 2019.04.17
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L21/3105 ; H01L21/311 ; H01L29/45

Abstract:
A semiconductor structure includes a first epitaxial source/drain (S/D) feature disposed over a first semiconductor fin, a second epitaxial S/D feature disposed over a second semiconductor fin and adjacent to the first epitaxial S/D feature, an interlayer dielectric (ILD) layer disposed over the first and the second epitaxial S/D features, a dielectric feature disposed In the ILD layer and contacting the second epitaxial S/D feature, and a conductive feature disposed in the ILD layer and contacting the first epitaxial S/D feature, where a portion of the conductive feature extends to contact the dielectric feature.
Public/Granted literature
- US20210074819A1 Methods of Forming Source/Drain Contacts in Field-Effect Transistors Public/Granted day:2021-03-11
Information query
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