Invention Grant
- Patent Title: Substrate processing system for removing peripheral portion of substrate, substrate processing method and computer readable recording medium thereof
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Application No.: US16978211Application Date: 2019-03-01
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Publication No.: US11752576B2Publication Date: 2023-09-12
- Inventor: Hayato Tanoue
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Shih IP Law Group, PLLC.
- Priority: JP 18047159 2018.03.14 JP 18087711 2018.04.27
- International Application: PCT/JP2019/008120 2019.03.01
- International Announcement: WO2019/176589A 2019.09.19
- Date entered country: 2020-09-04
- Main IPC: B23K26/36
- IPC: B23K26/36 ; H01L21/02 ; H01L21/268 ; H01L21/304
Abstract:
A substrate processing system configured to process a substrate includes a modification layer forming apparatus configured to form a modification layer within the substrate along a boundary between a peripheral portion of the substrate to be removed and a central portion of the substrate; and a periphery removing apparatus configured to remove the peripheral portion starting from the modification layer.
Public/Granted literature
- US20210039203A1 SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD AND COMPUTER-READABLE RECORDING MEDIUM Public/Granted day:2021-02-11
Information query
