- Patent Title: Method of preparing nanocomposite material plated with network-type metal layer through silica self-cracks and wearable electronics carbon fiber prepared therefrom
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Application No.: US17174005Application Date: 2021-02-11
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Publication No.: US11753722B2Publication Date: 2023-09-12
- Inventor: Hong-gun Kim , Hun Jeong , Leeku Kwac , Seonghun Back , Bobby Singh Soram
- Applicant: Jeonju University Office of Industry-University Cooperation , Hun Jeong
- Applicant Address: KR Jeonju-si
- Assignee: JEONJU UNIVERSITY OFFICE OF INDUSTRY-UNIVERSITY COOPERATION,Hun Jeong
- Current Assignee: JEONJU UNIVERSITY OFFICE OF INDUSTRY-UNIVERSITY COOPERATION,Hun Jeong
- Current Assignee Address: KR Jeonju-si; KR Jeonju-si
- Agency: Bridgeway IP Law Group, PLLC
- Agent Sang Ho Lee; Hyun Woo Shin
- Priority: KR 20200016602 2020.02.11 KR 20200019303 2020.02.17
- Main IPC: C23C18/18
- IPC: C23C18/18 ; C23C18/38 ; B82Y30/00 ; B82Y40/00 ; C23F1/10 ; C23C18/16

Abstract:
Provided is a method of preparing a nanocomposite material plated with a network-type metal layer through silica self-cracks and a wearable electronics carbon fiber prepared therefrom. The present disclosure provides a nanocomposite material having excellent electrical conductivity and bending resistance by plating a network-type metal layer on a substrate having a flat surface and/or a curved surface through a method of preparing the nanocomposite material in which the network-type metal layer is plated on silica self-cracks by applying a silica coating solution on the substrate having a flat or curved surface, performing drying after the applying of the silica coating solution to form the silica self-cracks having random crack directions and sizes, and performing electroless metal plating on the surface of the substrate. Further, the present disclosure provides a wearable electronics carbon fiber having excellent electrical conductivity and bending resistance.
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