Invention Grant
- Patent Title: EUV photomask
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Application No.: US17358785Application Date: 2021-06-25
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Publication No.: US11762277B2Publication Date: 2023-09-19
- Inventor: Moosong Lee , Seongbo Shim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20200140088 2020.10.27
- Main IPC: G03F1/22
- IPC: G03F1/22 ; G03F1/24

Abstract:
An EUV photomask may include a multi-layered structure on a substrate, a capping layer on the multi-layered structure, and an absorber on the capping layer. The absorber may include a first sidewall and a second sidewall. The first sidewall may extend from an upper surface of the capping layer in a vertical direction substantially perpendicular to an upper surface of the substrate, and may be a flat plane. The second sidewall may extend from the first sidewall in the vertical direction, and may be a curved surface.
Public/Granted literature
- US20220128897A1 EUV PHOTOMASK Public/Granted day:2022-04-28
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