- 专利标题: Critical dimension uniformity
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申请号: US17358407申请日: 2021-06-25
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公开(公告)号: US11763057B2公开(公告)日: 2023-09-19
- 发明人: Chi-Ta Lu , Chi-Ming Tsai
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: HAYNES AND BOONE, LLP
- 分案原申请号: US16175687 2018.10.30
- 主分类号: G06F30/39
- IPC分类号: G06F30/39 ; G06F111/06
摘要:
A method includes receiving a pattern layout for a mask, shrinking the pattern layout to form a shrunk pattern, determining centerlines for each of a plurality of features within the shrunk pattern, and snapping the centerline for each of the plurality of features to a grid. The grid represents a minimum resolution size of a mask fabrication tool. The method further includes, after snapping the centerline for each of the plurality of features to the grid, fabricating the mask with the shrunk pattern.
公开/授权文献
- US20210326507A1 Critical Dimension Uniformity 公开/授权日:2021-10-21
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