Invention Grant
- Patent Title: 3D memory semiconductor devices and structures with bit-line pillars
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Application No.: US17948225Application Date: 2022-09-20
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Publication No.: US11763864B2Publication Date: 2023-09-19
- Inventor: Zvi Or-Bach , Jin-Woo Han , Eli Lusky
- Applicant: Monolithic 3D Inc.
- Applicant Address: US OR Klamath Falls
- Assignee: Monolithic 3D Inc.
- Current Assignee: Monolithic 3D Inc.
- Current Assignee Address: US OR Klamath Falls
- Agency: PatentPC PowerPatent
- Agent Bao Tran
- Main IPC: G11C7/18
- IPC: G11C7/18 ; G11C7/12 ; G11C16/24 ; G11C16/04 ; H10B43/20

Abstract:
A 3D memory device, the device including: a plurality of memory cells, where each memory cell of the plurality of memory cells includes at least one memory transistor, where each of the at least one memory transistor includes a source, a drain, and a channel; and a plurality of bit-line pillars, where each bit-line pillar of the plurality of bit-line pillars is directly connected to a plurality of the source or the drain, where the plurality of bit-line pillars are vertically oriented, where the channel is horizontally oriented, where a plurality of the channels are connected to a body pillar, and where the body pillar is at least temporary connected to a negative bias.
Public/Granted literature
- US20230018701A1 3D MEMORY SEMICONDUCTOR DEVICES AND STRUCTURES WITH BIT-LINE PILLARS Public/Granted day:2023-01-19
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