Invention Grant
- Patent Title: Control method and plasma processing apparatus
-
Application No.: US16978193Application Date: 2019-07-17
-
Publication No.: US11764082B2Publication Date: 2023-09-19
- Inventor: Chishio Koshimizu , Shinji Kubota , Koji Maruyama , Takashi Dokan , Koichi Nagami
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP 18142855 2018.07.30 JP 19108223 2019.06.10
- International Application: PCT/JP2019/028024 2019.07.17
- International Announcement: WO2020/026802A 2020.02.06
- Date entered country: 2020-09-04
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/67 ; H01J37/32

Abstract:
A control method of a plasma processing apparatus including a first electrode and a second electrode includes supplying a bias power to the first electrode, and supplying a negative DC voltage to the second electrode. The negative DC voltage periodically repeats a first state that takes a first voltage value and a second state that takes a second voltage value having an absolute value smaller than the first voltage value. The control method further includes a first control process of applying the first state of the negative DC voltage in a partial time period within each cycle of a signal synchronized with a cycle of a radio frequency of the bias power, or in a partial time period within each cycle of a periodically varying parameter measured in a transmission path of the bias power, and applying the second state continuously with the first state.
Public/Granted literature
- US20210043472A1 CONTROL METHOD AND PLASMA PROCESSING APPARATUS Public/Granted day:2021-02-11
Information query
IPC分类: