Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US17859346Application Date: 2022-07-07
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Publication No.: US11769663B2Publication Date: 2023-09-26
- Inventor: Masayuki Otsuji , Hiroaki Takahashi , Masahiko Kato , Yu Yamaguchi , Yuta Sasaki
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: OSTROLENK FABER LLP
- Priority: JP 19120652 2019.06.28 JP 20001888 2020.01.09
- Main IPC: B08B7/00
- IPC: B08B7/00 ; H01L21/02 ; B08B3/08 ; H01L21/687 ; H01L21/67

Abstract:
To dry a substrate formed with a pattern on a front surface satisfactorily and with excellent drying performance, a substrate processing method comprises: a liquid film formation step of forming a liquid film of a processing liquid, in which cyclohexanone oxime is dissolved in a solvent, on a front surface of a substrate formed with a pattern by supplying the processing liquid to the front surface of the substrate; a solidified film formation step of forming a solidified film of the cyclohexanone oxime by solidifying the liquid film of the processing liquid; and a sublimation step of removing the solidified film from the front surface of the substrate by sublimating the solidified film.
Public/Granted literature
- US20220351967A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2022-11-03
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