Invention Grant
- Patent Title: Bottom fed sublimation bed for high saturation efficiency in semiconductor applications
-
Application No.: US18095053Application Date: 2023-01-10
-
Publication No.: US11773485B2Publication Date: 2023-10-03
- Inventor: David Marquardt , Carl White , Mohith Verghese
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: C23C16/40
- IPC: C23C16/40 ; C23C16/448 ; C23C16/44

Abstract:
Bottom-fed ampoules for a semiconductor manufacturing precursors and methods of use are described. The ampoules comprise an outer cylindrical wall and an inner cylindrical wall defining a flow channel in between and a bottom wall having a top surface with a plurality of concentric elongate walls, each wall comprising an opening offset from the opening in adjacent walls defining a gas exchange zone through which a carrier gas flows in contact with the precursor.
Public/Granted literature
- US20230160064A1 BOTTOM FED SUBLIMATION BED FOR HIGH SATURATION EFFICIENCY IN SEMICONDUCTOR APPLICATIONS Public/Granted day:2023-05-25
Information query
IPC分类: