Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method, and storage medium
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Application No.: US17464926Application Date: 2021-09-02
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Publication No.: US11773492B2Publication Date: 2023-10-03
- Inventor: Shogo Inaba , Masatoshi Kawakita
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JP 20148900 2020.09.04
- Main IPC: B05C5/02
- IPC: B05C5/02 ; C23C18/20 ; C23C18/16

Abstract:
A substrate processing apparatus for forming a coating film on a peripheral edge portion including a peripheral edge of a front surface and a side surface of a substrate, includes: a substrate holder for rotatably holding the substrate; a first chemical liquid supplier for supplying a first chemical liquid onto the peripheral edge including a rear surface of the substrate; a partial removing part for removing the first chemical liquid adhering to at least a portion of the front and side surfaces; a second chemical liquid supplier for supplying a second chemical liquid for forming the coating film onto the front and side surfaces; a first chemical liquid removing part for removing the first chemical liquid remaining on the substrate to which the second chemical liquid adheres; and a controller for controlling the parts described above.
Public/Granted literature
- US20220074053A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM Public/Granted day:2022-03-10
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