Invention Grant
- Patent Title: Multi-piece layered honeycomb extrusion dies and methods of making same
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Application No.: US17103524Application Date: 2020-11-24
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Publication No.: US11780115B2Publication Date: 2023-10-10
- Inventor: Samir Biswas , Memduh Volkan Demirbas , Ryan Joseph Grohsmeyer , Mark Lee Humphrey , Zakariya Radwan Khayat , Kenneth Richard Miller
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Joseph M. Homa
- Main IPC: B29C48/00
- IPC: B29C48/00 ; B28B3/26

Abstract:
Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.
Public/Granted literature
- US20210154885A1 MULTI-PIECE LAYERED HONEYCOMB EXTRUSION DIES AND METHODS OF MAKING SAME Public/Granted day:2021-05-27
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