公开(公告)号：US20220234108A1

公开(公告)日：2022-07-28

申请号：US17613822

申请日：2020-05-21

Applicant: CORNING INCORPORATED

Inventor： Timothy Eugene Antesberger ,  Dana Craig Bookbinder ,  Dana Eugene Coots ,  Seyed Amir Farzadfar ,  Dominick John Forenz ,  Ryan Joseph Grohsmeyer ,  Mark Lee Humphrey ,  Zakariya Radwan Khayat ,  Kenneth Richard Miller ,  Richard Curwood Peterson ,  John Charles Rector

IPC: B22F10/28 ,  B22F1/052 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y80/00 ,  B29C48/30 ,  B29C48/32 ,  B28B3/26

Abstract: Methods for forming an electrode for use in forming a honeycomb extrusion die. The method includes forming, by means of an additive manufacturing process, an electrode includes a base having a web extending from the base. The web defines a matrix of cellular openings. The method further includes forming a secondary electrode having a plurality of pins. The plurality of pins are shaped and arranged so as to mate with the matrix of cellular openings defined by the web of the electrode. The method further includes machining the electrode using the secondary electrode to smooth surfaces of the electrode formed by the additive manufacturing process.

公开(公告)号：US11833604B2

公开(公告)日：2023-12-05

申请号：US17613822

申请日：2020-05-21

Applicant: CORNING INCORPORATED

Inventor： Timothy Eugene Antesberger ,  Dana Craig Bookbinder ,  Dana Eugene Coots ,  Seyed Amir Farzadfar ,  Dominick John Forenz ,  Ryan Joseph Grohsmeyer ,  Mark Lee Humphrey ,  Zakariya Radwan Khayat ,  Kenneth Richard Miller ,  Richard Curwood Peterson ,  John Charles Rector

IPC: B23H7/24 ,  B33Y10/00 ,  B22F10/28 ,  B22F10/36 ,  B22F10/38 ,  B33Y80/00 ,  B29C48/30 ,  B29C48/32 ,  B33Y40/20 ,  B28B3/26 ,  B22F10/66 ,  B22F10/62 ,  B22F10/25

CPC classification number: B23H7/24 ,  B22F10/28 ,  B22F10/66 ,  B28B3/269 ,  B29C48/3001 ,  B29C48/32 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y80/00 ,  B22F10/25 ,  B22F10/36 ,  B22F10/38 ,  B22F10/62 ,  B22F2301/10 ,  B22F2301/20 ,  B22F2304/10 ,  B22F2998/10 ,  B22F10/28 ,  B22F10/38 ,  B22F10/66 ,  B22F3/26 ,  B22F2999/00 ,  C22C1/045 ,  B22F1/09

Abstract: Methods for forming an electrode for use in forming a honeycomb extrusion die. The method includes forming, by means of an additive manufacturing process, an electrode includes a base having a web extending from the base. The web defines a matrix of cellular openings. The method further includes forming a secondary electrode having a plurality of pins. The plurality of pins are shaped and arranged so as to mate with the matrix of cellular openings defined by the web of the electrode. The method further includes machining the electrode using the secondary electrode to smooth surfaces of the electrode formed by the additive manufacturing process.

公开(公告)号：US12049022B2

公开(公告)日：2024-07-30

申请号：US18243929

申请日：2023-09-08

Applicant: CORNING INCORPORATED

Inventor： Samir Biswas ,  Memduh Volkan Demirbas ,  Ryan Joseph Grohsmeyer ,  Mark Lee Humphrey ,  Zakariya Radwan Khayat ,  Kenneth Richard Miller

IPC: B29C48/00 ,  B28B3/26

CPC classification number: B28B3/269

Abstract: Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.

公开(公告)号：US20230415374A1

公开(公告)日：2023-12-28

申请号：US18243929

申请日：2023-09-08

Applicant: CORNING INCORPORATED

Inventor： Samir Biswas ,  Memduh Volkan Demirbas ,  Ryan Joseph Grohsmeyer ,  Mark Lee Humphrey ,  Zakariya Radwan Khayat ,  Kenneth Richard Miller

IPC: B28B3/26

CPC classification number: B28B3/269

Abstract: Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.

公开(公告)号：US11780115B2

公开(公告)日：2023-10-10

申请号：US17103524

申请日：2020-11-24

Applicant: CORNING INCORPORATED

Inventor： Samir Biswas ,  Memduh Volkan Demirbas ,  Ryan Joseph Grohsmeyer ,  Mark Lee Humphrey ,  Zakariya Radwan Khayat ,  Kenneth Richard Miller

IPC: B29C48/00 ,  B28B3/26

CPC classification number: B28B3/269

Abstract: Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.

公开(公告)号：US20210154885A1

公开(公告)日：2021-05-27

申请号：US17103524

申请日：2020-11-24

Applicant: CORNING INCORPORATED

Inventor： Samir Biswas ,  Memduh Volkan Demirbas ,  Ryan Joseph Grohsmeyer ,  Mark Lee Humphrey ,  Zakariya Radwan Khayat ,  Kenneth Richard Miller

IPC: B28B3/26

Abstract: Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.