Invention Grant
- Patent Title: Multifunctional collimator for contact image sensors
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Application No.: US17883592Application Date: 2022-08-08
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Publication No.: US11782284B2Publication Date: 2023-10-10
- Inventor: Hsin-Yu Chen , Yen-Chiang Liu , Jiun-Jie Chiou , Jia-Syuan Li , You-Cheng Jhang , Shin-Hua Chen , Lavanya Sanagavarapu , Han-Zong Pan , Chun-Peng Li , Chia-Chun Hung , Ching-Hsiang Hu , Wei-Ding Wu , Jui-Chun Weng , Ji-Hong Chiang , Hsi-Cheng Hsu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: G02B27/30
- IPC: G02B27/30 ; G02B5/20 ; H01L27/14 ; G02B26/00 ; H01L27/146 ; H01L31/0216 ; G06V40/13

Abstract:
Disclosed is a cost-effective method to fabricate a multifunctional collimator structure for contact image sensors to filter ambient infrared light to reduce noises. In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; a plurality of via holes; and a conductive layer, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction.
Public/Granted literature
- US20220382069A1 MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS Public/Granted day:2022-12-01
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