Semiconductor memory device having memory chip bonded to a CMOS chip including a peripheral circuit
Abstract:
According to one embodiment, a semiconductor memory device includes a first bit line extending in a first direction and coupled to a first memory cell, a first pad coupled to the first bit line, a first sense amplifier coupled to the first pad, a second bit line being adjacent to the first bit line and extending in the first direction and coupled to a second memory cell, a second pad coupled to the second bit line, and a second sense amplifier coupled to the second pad. The first and second sense amplifiers are adjacent to each other and are arranged in a second direction intersecting the first direction. The first and second pads are adjacent to each other and are arranged in a third direction intersecting the first direction and the second direction.
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