Invention Grant
- Patent Title: Semiconductor memory device having memory chip bonded to a CMOS chip including a peripheral circuit
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Application No.: US17472361Application Date: 2021-09-10
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Publication No.: US11783888B2Publication Date: 2023-10-10
- Inventor: Hiroshi Maejima
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP 21045906 2021.03.19
- Main IPC: G11C7/12
- IPC: G11C7/12 ; G11C11/4091 ; G11C11/4094 ; G11C5/06 ; G11C11/4074 ; G11C11/408 ; G11C16/24 ; G11C16/26 ; G11C16/04 ; H10B43/10 ; G11C7/18

Abstract:
According to one embodiment, a semiconductor memory device includes a first bit line extending in a first direction and coupled to a first memory cell, a first pad coupled to the first bit line, a first sense amplifier coupled to the first pad, a second bit line being adjacent to the first bit line and extending in the first direction and coupled to a second memory cell, a second pad coupled to the second bit line, and a second sense amplifier coupled to the second pad. The first and second sense amplifiers are adjacent to each other and are arranged in a second direction intersecting the first direction. The first and second pads are adjacent to each other and are arranged in a third direction intersecting the first direction and the second direction.
Public/Granted literature
- US20220301615A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2022-09-22
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