Invention Grant
- Patent Title: Pixel-array substrate and associated method
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Application No.: US17080780Application Date: 2020-10-26
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Publication No.: US11784206B2Publication Date: 2023-10-10
- Inventor: Hui Zang , Gang Chen
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: COZEN O'CONNOR
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L27/148

Abstract:
A pixel-array substrate includes a floating diffusion region and a first photodiode formed in a semiconductor substrate. A top surface of the semiconductor substrate defines a trench 1A and a trench 1B each (i) extending into the semiconductor substrate away from a planar region of the top surface between the trench 1A and the trench 1B and (ii) having a respective distal end, with respect to the floating diffusion region, located between the floating diffusion region and the first photodiode. In a horizontal plane parallel to the top surface and along an inter-trench direction between the trench 1A and the trench 1B, a first spatial separation between the trench 1A and the trench 1B increases with increasing distance from the floating diffusion region.
Public/Granted literature
- US20220130885A1 PIXEL-ARRAY SUBSTRATE AND ASSOCIATED METHOD Public/Granted day:2022-04-28
Information query
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