A method for manufacturing an electronic device includes the following steps. A substrate including a first region and a second region is provided. A seed layer is formed on the substrate. A circuit structure layer is formed on the seed layer, and the circuit structure layer has a plurality of first circuit structures disposed on the first region and a plurality of second circuit structures disposed on the second region. The first circuit structures and the second circuit structures are electrically connected through the seed layer. A circuit test process is performed and includes applying a predetermined voltage to the second circuit structures to test the first circuit structures to determine whether the first circuit structures are normal or not.