Invention Grant
- Patent Title: Gas heat-pump system
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Application No.: US17110609Application Date: 2020-12-03
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Publication No.: US11796231B2Publication Date: 2023-10-24
- Inventor: Heejoong Jang , Hojong Jeong
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: KED & ASSOCIATES, LLP
- Priority: KR 20190161649 2019.12.06
- Main IPC: F25B27/00
- IPC: F25B27/00 ; F02B33/40 ; F02B39/10 ; F02D29/04 ; F02M26/08 ; F02D23/00 ; F02B47/08

Abstract:
Proposed is a gas heat-pump system including: a compressor of an air conditioning module; a gas engine generating a drive force of the compressor; and a turbocharger primarily first-level pressure to a fuel-to-air mixture and supplying the fuel-to-air mixture to the gas engine or applying second-level pressure to the fuel-to-air mixture to which the first-level pressure is applied and supplying the fuel-to-air mixture to the gas engine.
Public/Granted literature
- US20210172656A1 GAS HEAT-PUMP SYSTEM Public/Granted day:2021-06-10
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