Invention Grant
- Patent Title: Quantum device including shield part and method of manufacturing the same
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Application No.: US17357233Application Date: 2021-06-24
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Publication No.: US11798895B2Publication Date: 2023-10-24
- Inventor: Kenji Nanba , Ayami Yamaguchi , Akira Miyata , Katsumi Kikuchi , Suguru Watanabe , Takanori Nishi , Hideyuki Satou
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 20111954 2020.06.29
- Main IPC: H01L23/552
- IPC: H01L23/552 ; G06N10/40 ; H01L23/498
Abstract:
A quantum device (100) includes an interposer (112), a quantum chip (111) mounted on the interposer (112), and a shield part (150) provided so as to surround a quantum circuit region of the interposer (112) and the quantum chip (111). Accordingly, the quantum device (100) is able to prevent interference in the quantum circuit region due to exogenous noise.
Public/Granted literature
- US20210407928A1 QUANTUM DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-12-30
Information query
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