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公开(公告)号：US12108690B2
公开(公告)日：2024-10-01
申请号：US17347784
申请日：2021-06-15
申请人： NEC Corporation
发明人： Katsumi Kikuchi , Akira Miyata , Suguru Watanabe , Takanori Nishi , Hideyuki Satou , Kenji Nanba , Ayami Yamaguchi
CPC分类号： H10N60/815 , H01R12/714 , H01R13/24
摘要： A quantum device capable of securing terminals for external connection is provided. A quantum device according to an example embodiment includes a quantum chip 10, an interposer 20 on which the quantum chip 10 is mounted, and a socket 40 disposed so as to be opposed to the interposer 20, the socket 40 comprising a movable pin 47 and a housing 45 supporting the movable pin 47, in which at least one end of the movable pin 47, which includes the one end and the other end opposite to the one end, is movable relative to the housing 45, the one end being in electrical contact with a terminal of the interposer 20, and the other end is in an electrical contact with a terminal of a board 50 on which a connector 51 is formed, the connector 51 being configured to serve as an external input/output.
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公开(公告)号：US11696517B2
公开(公告)日：2023-07-04
申请号：US17349281
申请日：2021-06-16
申请人： NEC Corporation
发明人： Kenji Nanba , Ayami Yamaguchi , Akira Miyata , Katsumi Kikuchi , Suguru Watanabe , Takanori Nishi , Hideyuki Satou
摘要： A quantum device (100) includes: an interposer (112); a quantum chip (111); and a connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111), in which the connection part (130) includes: a plurality of pillars (131) arranged on a main surface of the interposer (112); and a metal film (132) provided on a surface of the plurality of pillars (131) in such a way that it contacts the wiring layer of the quantum chip (111) and the thickness of the metal film at outer peripheral parts of the tip of each of the plurality of pillars (131) becomes larger than the thickness of the metal film at a center part of the tip of each of the plurality of pillars (131).
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公开(公告)号：US11871682B2
公开(公告)日：2024-01-09
申请号：US17349180
申请日：2021-06-16
申请人： NEC Corporation
发明人： Kenji Nanba , Ayami Yamaguchi , Akira Miyata , Katsumi Kikuchi , Suguru Watanabe , Takanori Nishi , Hideyuki Satou
IPC分类号： H10N60/81 , H01L23/498 , H01L23/34 , H10N60/01 , G06N10/00
CPC分类号： H10N60/81 , H01L23/34 , H01L23/49822 , H01L23/49838 , H10N60/01 , G06N10/00 , H01L23/49827 , H01L23/49888
摘要： A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); and a second connection part (140) that is provided on a main surface of the interposer (112) where the first connection part (130) is arranged and is connected to a cooling plate (115).
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公开(公告)号：US11798895B2
公开(公告)日：2023-10-24
申请号：US17357233
申请日：2021-06-24
申请人： NEC Corporation
发明人： Kenji Nanba , Ayami Yamaguchi , Akira Miyata , Katsumi Kikuchi , Suguru Watanabe , Takanori Nishi , Hideyuki Satou
IPC分类号： H01L23/552 , G06N10/40 , H01L23/498
CPC分类号： H01L23/552 , H01L23/49888
摘要： A quantum device (100) includes an interposer (112), a quantum chip (111) mounted on the interposer (112), and a shield part (150) provided so as to surround a quantum circuit region of the interposer (112) and the quantum chip (111). Accordingly, the quantum device (100) is able to prevent interference in the quantum circuit region due to exogenous noise.
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公开(公告)号：US11805708B2
公开(公告)日：2023-10-31
申请号：US17347820
申请日：2021-06-15
申请人： NEC Corporation
发明人： Katsumi Kikuchi , Akira Miyata , Suguru Watanabe , Takanori Nishi , Hideyuki Satou , Kenji Nanba , Ayami Yamaguchi
CPC分类号： H10N60/124 , G06N10/00 , H10N60/805 , H10N69/00
摘要： A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22, the conductive wiring line CL1 is disposed in the first area AR11 on the mounting surface 21 or the opposite surface 22, and a movable member 60 is in contact with the second area AR12 of the interposer 20.
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公开(公告)号：US20230309419A1
公开(公告)日：2023-09-28
申请号：US18123038
申请日：2023-03-17
申请人： NEC Corporation
发明人： Katsumi KIKUCHI , Akira Miyata , Takanori Nishi , Kenji Nanba , Ayami Yamaguchi
CPC分类号： H10N60/81 , H01L24/16 , H01L24/13 , H01L24/14 , H01L2224/16227 , H01L2224/13147 , H01L2224/13186 , H01L2924/05442 , H01L2924/0504 , H01L2924/059 , H01L2224/1413
摘要： A quantum device includes a chip including a superconducting circuit, a first wiring substrate, a second wiring substrate, first connection portions connecting the chip and a wiring layer on a first surface of the first wiring substrate and second connection portions connecting the second wiring substrate and a wiring layer on a second surface of the first wiring substrate, wherein one or more second connection portions arranged in a first row as viewed from the edge of the first substrate are provided at positions corresponding respectively to one or more of the first connection portions arranged in a first row as viewed from the edge and are arranged closer to the edge than the first connection portions arranged in the first row.
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公开(公告)号：US12094812B2
公开(公告)日：2024-09-17
申请号：US17345426
申请日：2021-06-11
申请人： NEC Corporation
发明人： Katsumi Kikuchi , Akira Miyata , Suguru Watanabe , Takanori Nishi , Hideyuki Satou , Kenji Nanba , Ayami Yamaguchi
IPC分类号： H01L23/498 , H10N60/80
CPC分类号： H01L23/49838 , H10N60/805
摘要： A quantum device capable of improving a cooling effect while securing the number of terminals is provided. A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, and a metal film 70 disposed in a part of the interposer 20 that is in contact with a sample stage 30 having a cooling function, and a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22.
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公开(公告)号：US20210408358A1
公开(公告)日：2021-12-30
申请号：US17355528
申请日：2021-06-23
申请人： NEC Corporation
发明人： Kenji Nanba , Ayami Yamaguchi , Akira Miyata , Katsumi Kikuchi , Suguru Watanabe , Takanori Nishi , Hideyuki Satou
摘要： A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); a predetermined signal line (w1) arranged in the wiring layer of the quantum chip (111); first shield wires (ws1) arranged in the wiring layer of the quantum chip (111) along the predetermined signal line (w1); a second shield wire (ws2) arranged in the wiring layer of the interposer (112); and a second connection part (150) that is provided between the interposer (112) and the quantum chip (111) so as to contact the first shield wires (ws1) and the second shield wire (ws2).
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