Invention Grant
- Patent Title: Semiconductor packages
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Application No.: US17092195Application Date: 2020-11-06
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Publication No.: US11798907B2Publication Date: 2023-10-24
- Inventor: Yung-Sheng Lin , Yun-Ching Hung , An-Hsuan Hsu , Chung-Hung Lai
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A semiconductor package includes a first substrate, a first flow channel and a second flow channel. The first flow channel is on the first substrate. The second flow channel is on the first substrate and in fluid communication with the first flow channel. The second flow channel is spaced from an inlet and an outlet of the first flow channel. The first flow channel and the second flow channel constitute a bonding region of the first substrate.
Public/Granted literature
- US20220148989A1 SEMICONDUCTOR PACKAGES Public/Granted day:2022-05-12
Information query
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