Invention Grant
- Patent Title: Offset interposers for large-bottom packages and large-die package-on-package structures
-
Application No.: US17855664Application Date: 2022-06-30
-
Publication No.: US11798932B2Publication Date: 2023-10-24
- Inventor: Russell K. Mortensen , Robert M. Nickerson , Nicholas R. Watts
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L21/56 ; H01L21/60 ; H01L23/02 ; H01L23/28 ; H01L23/31 ; H01L23/48 ; H01L23/52 ; H01L23/488 ; H01L23/498 ; H01L23/538 ; H01L23/552 ; H01L25/10 ; H01L25/11 ; H01L25/18 ; H01L23/00 ; H05K1/11 ; H05K3/40 ; H01L25/00 ; H01L25/065
Abstract:
An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side BGA includes two adjacent, spaced-apart land-side pads, and the POP-side BGA includes two adjacent, spaced-apart POP-side pads that are coupled to the respective two land-side BGA pads through the offset interposer. The land-side BGA is configured to interface with a first-level interconnect. The POP-side BGA is configured to interface with a POP substrate. Each of the two land-side pads has a different footprint than the respective two POP-side pads.
Public/Granted literature
- US20220344318A1 OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES Public/Granted day:2022-10-27
Information query
IPC分类:
