Invention Grant
- Patent Title: Multilayered electronic component
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Application No.: US17665462Application Date: 2022-02-04
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Publication No.: US11804332B2Publication Date: 2023-10-31
- Inventor: Hye Jin Park , Bon Seok Koo , Jung Min Kim , Hong Je Choi , Byung Woo Kang , Ji Hye Han , Sang Wook Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20210168414 2021.11.30
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/12 ; H01G4/232 ; H01G2/06 ; H01G4/008

Abstract:
A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes respectively disposed on the body, wherein the external electrode includes: a first electrode layer connected to the internal electrode; and a second electrode layer disposed on the first electrode layer, and including a conductive portion including an silver (Ag)-tin (Sn) alloy and a resin, and a ratio of an area of the Ag—Sn alloy to an area of the conductive portion satisfies 3 to 50% in at least a portion of a cross-section of the second electrode layer.
Public/Granted literature
- US20230170147A1 MULTILAYERED ELECTRONIC COMPONENT Public/Granted day:2023-06-01
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