Invention Publication
- Patent Title: MULTILAYERED ELECTRONIC COMPONENT
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Application No.: US17665462Application Date: 2022-02-04
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Publication No.: US20230170147A1Publication Date: 2023-06-01
- Inventor: Hye Jin PARK , Bon Seok KOO , Jung Min KIM , Hong Je CHOI , Byung Woo KANG , Ji Hye HAN , Sang Wook LEE
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20210168414 2021.11.30
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/008 ; H01G4/232 ; H01G2/06 ; H01G4/12

Abstract:
A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes respectively disposed on the body, wherein the external electrode includes: a first electrode layer connected to the internal electrode; and a second electrode layer disposed on the first electrode layer, and including a conductive portion including an silver (Ag)-tin (Sn) alloy and a resin, and a ratio of an area of the Ag—Sn alloy to an area of the conductive portion satisfies 3 to 50% in at least a portion of a cross-section of the second electrode layer.
Public/Granted literature
- US11804332B2 Multilayered electronic component Public/Granted day:2023-10-31
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