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公开(公告)号：US20230094110A1
公开(公告)日：2023-03-30
申请号：US17572176
申请日：2022-01-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jung Min Kim , Hong Je Choi , Ji Hye Han , Byung Woo Kang , Hye Jin Park , Sang Wook Lee , Bon Seok Koo , Jung Won Lee
Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on one surface of the body, wherein the external electrode includes first electrode layers disposed on the one surface of the body to be spaced apart from each other, and covering a region of the one surface of the body through which the internal electrode layer is exposed; a second electrode layer including a base resin and a conductive connection portion disposed in the base resin, and disposed on the one surface of the body to cover the first electrode layers; and an intermetallic compound disposed only between each of the first electrode layers and the second electrode layer.
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公开(公告)号：US20220139618A1
公开(公告)日：2022-05-05
申请号：US17308273
申请日：2021-05-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Woo Kang , Bon Seok Koo , Jeong Ryeol Kim , Jung Min Kim , Jae Seok Yi , Ji Hye Han , Hye Jin Park
Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.
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公开(公告)号：US11817269B2
公开(公告)日：2023-11-14
申请号：US17747432
申请日：2022-05-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hong Je Choi , Jung Min Kim , Ji Hye Han , Byung Woo Kang , Hye Jin Park , Sang Wook Lee , Bon Seok Koo , Jung Won Lee
CPC classification number: H01G4/2325 , H01G4/008 , H01G4/30
Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body, wherein each of the first and second external electrodes includes a conductive resin layer including a resin, a plurality of metal particles, and a conductive connection portion connecting portions of the plurality of metal particles to each other, and in the conductive resin layer, a volume ratio of metal particles spaced apart from the conductive connection portion, among the plurality of metal particles, to a sum of the plurality of metal particles and the conductive connection portion is greater than 0% and less than 4.9%.
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公开(公告)号：US11817267B2
公开(公告)日：2023-11-14
申请号：US17712420
申请日：2022-04-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Woo Kang , Bon Seok Koo , Jung Min Kim , Ji Hye Han , Hye Jin Park , Sang Wook Lee , Hong Je Choi
CPC classification number: H01G4/2325 , H01G4/30 , H01G4/248
Abstract: A multilayer capacitor, includes: a body including a dielectric layer and first and second internal electrode, and a first external electrode and a second external electrode, each disposed an exterior of the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first external electrode and the second external electrode include an electrode layer disposed on the body, and including a first intermetallic compound and glass; and a conductive resin layer disposed on the electrode layer, and including a plurality of metal particles and a resin.
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公开(公告)号：US20230290572A1
公开(公告)日：2023-09-14
申请号：US18198419
申请日：2023-05-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Woo Kang , Bon Seok Koo , Jeong Ryeol Kim , Jung Min Kim , Jae Seok Yi , Ji Hye Han , Hye Jin Park
Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.
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Patent Agency Ranking
公开(公告)号：US20240371570A1
公开(公告)日：2024-11-07
申请号：US18774662
申请日：2024-07-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Woo Kang , Bon Seok Koo , Jeong Ryeol Kim , Jung Min Kim , Jae Seok Yi , Ji Hye Han , Hye Jin Park
Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.
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公开(公告)号：US12068110B2
公开(公告)日：2024-08-20
申请号：US18198419
申请日：2023-05-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Woo Kang , Bon Seok Koo , Jeong Ryeol Kim , Jung Min Kim , Jae Seok Yi , Ji Hye Han , Hye Jin Park
Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.
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公开(公告)号：US12009154B2
公开(公告)日：2024-06-11
申请号：US17682023
申请日：2022-02-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ji Hye Han , Jung Min Kim , Byung Woo Kang , Hong Je Choi , Hye Jin Park , Sang Wook Lee , Bon Seok Koo , Jung Won Lee
CPC classification number: H01G4/2325 , H01G4/30
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin. A ratio of a length of a first direction component of a region having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more.
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公开(公告)号：US11804332B2
公开(公告)日：2023-10-31
申请号：US17665462
申请日：2022-02-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Jin Park , Bon Seok Koo , Jung Min Kim , Hong Je Choi , Byung Woo Kang , Ji Hye Han , Sang Wook Lee
Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes respectively disposed on the body, wherein the external electrode includes: a first electrode layer connected to the internal electrode; and a second electrode layer disposed on the first electrode layer, and including a conductive portion including an silver (Ag)-tin (Sn) alloy and a resin, and a ratio of an area of the Ag—Sn alloy to an area of the conductive portion satisfies 3 to 50% in at least a portion of a cross-section of the second electrode layer.
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公开(公告)号：US11694844B2
公开(公告)日：2023-07-04
申请号：US17308273
申请日：2021-05-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Woo Kang , Bon Seok Koo , Jeong Ryeol Kim , Jung Min Kim , Jae Seok Yi , Ji Hye Han , Hye Jin Park
Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.
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