- 专利标题： Manufacturing method of semiconductor package using jig
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申请号： US17149737申请日： 2021-01-15
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公开(公告)号： US11804468B2公开(公告)日： 2023-10-31
- 发明人: Chih-Hao Chen , Chih-Chien Pan , Pu Wang , Li-Hui Cheng , Szu-Wei Lu
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： JCIPRNET
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/52 ; H01L21/48 ; H01L21/67 ; H01L23/40
摘要：
A jig for manufacturing a semiconductor package includes a bottom piece and an upper piece. The bottom piece includes a base, a support plate, and at least one elastic connector. The support plate is located in a central region of the base. The at least one elastic connector is interposed between the support plate and the base. The upper piece includes a cap and outer flanges. The cap overlays the support plate when the upper piece is disposed on the bottom piece. The outer flanges are disposed at edges of the cap, connected with the cap. The outer flanges contact the base of the bottom piece when the upper piece is disposed on the bottom piece. The cap includes an opening which is a through hole. When the upper piece is disposed on the bottom piece, a vertical projection of the opening falls entirely on the support plate.
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