Invention Grant
- Patent Title: Systems and methods for shielded inductive devices
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Application No.: US17585372Application Date: 2022-01-26
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Publication No.: US11804515B2Publication Date: 2023-10-31
- Inventor: Feng Wei Kuo , Chewn-Pu Jou , Huan-Neng Chen , Lan-Chou Cho , Robert Bogdan Staszewski
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- The original application number of the division: US15965476 2018.04.27
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H03L7/085 ; H01L49/02 ; H01F27/28 ; H03L7/099 ; B01D1/00 ; B01D1/12 ; C02F1/04 ; C02F11/12 ; C02F11/18 ; C02F101/30 ; C02F103/14 ; C02F103/16 ; C02F103/28 ; C02F103/32 ; C02F103/34 ; C02F103/36

Abstract:
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
Public/Granted literature
- US20220149146A1 SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES Public/Granted day:2022-05-12
Information query
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