Invention Grant
- Patent Title: Integrated assemblies having rugged material fill, and methods of forming integrated assemblies
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Application No.: US16542645Application Date: 2019-08-16
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Publication No.: US11805645B2Publication Date: 2023-10-31
- Inventor: Nicholas R. Tapias , Andrew Li , Adam W. Saxler , Kunal Shrotri , Erik R. Byers , Matthew J. King , Diem Thy N. Tran , Wei Yeeng Ng , Anish A. Khandekar
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H10B43/27
- IPC: H10B43/27 ; H01L21/02 ; H01L21/285 ; H10B41/27

Abstract:
Some embodiments include a structure having an opening extending into an integrated configuration. A first material is within the opening, and is configured to create an undulating topography relative to a sidewall of the opening. The undulating topography has a surface roughness characterized by a mean roughness parameter Rmean which is the mean peak-to-valley distance along the undulating topography. The Rmean is at least about 4 nm. A second material is within the opening and along at least a portion of the undulating topography. The first and second materials are compositionally different from one another. Some embodiments include integrated assemblies. Some embodiments include methods of forming integrated assemblies.
Public/Granted literature
- US20210050364A1 Integrated Assemblies Having Rugged Material Fill, and Methods of Forming Integrated Assemblies Public/Granted day:2021-02-18
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