Invention Grant
- Patent Title: Silica-including microcapsule resin particles, method for producing same, and application thereof
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Application No.: US17173334Application Date: 2021-02-11
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Publication No.: US11806414B2Publication Date: 2023-11-07
- Inventor: Akiyoshi Kusaka , Yoshinao Yamaji , Ryosuke Harada
- Applicant: SEKISUI PLASTICS CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI PLASTICS CO., LTD.
- Current Assignee: SEKISUI PLASTICS CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- Priority: JP 16037351 2016.02.29
- Main IPC: A61K9/50
- IPC: A61K9/50 ; A61K8/11 ; A61K8/25 ; A61Q19/00 ; A61K8/02 ; C01B33/159 ; G02B1/04 ; B32B27/18 ; C09D7/40 ; A61Q1/00 ; G02B5/02 ; B01J13/06 ; C09D7/65 ; C09D7/61 ; A61Q1/12 ; B01J13/18
Abstract:
Silica-including microcapsule resin particles including an outer shell constituted of a crosslinked polymer and a cavity partitioned with the outer shell, in which the silica-including microcapsule resin particles contain inside the cavity a porous structure in which silica particles are mutually connected, and have a volume average particle diameter of 0.5 to 100 μm.
Public/Granted literature
- US20210161776A1 SILICA-INCLUDING MICROCAPSULE RESIN PARTICLES, METHOD FOR PRODUCING SAME, AND APPLICATION THEREOF Public/Granted day:2021-06-03
Information query
