Invention Grant
- Patent Title: Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate, and printed wiring board
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Application No.: US17771079Application Date: 2020-10-21
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Publication No.: US11814502B2Publication Date: 2023-11-14
- Inventor: Akihiro Yamauchi , Eiichiro Saito , Nobuo Shibata , Kouichi Aoki
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- Priority: JP 19194706 2019.10.25
- International Application: PCT/JP2020/039516 2020.10.21
- International Announcement: WO2021/079900A 2021.04.29
- Date entered country: 2022-04-22
- Main IPC: C08K3/26
- IPC: C08K3/26 ; C08J5/24 ; C08K3/22 ; C08K9/06 ; C08L63/00

Abstract:
A resin composition contains a thermosetting resin (A) and an inorganic filler (B). The inorganic filler (B) includes: a first filler (B1); and a second filler (B2) of a nanometer scale having a smaller particle size than the first filler (B1). The first filler (B1) includes an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2). The proportion of the first filler (B1) relative to a total solid content in the resin composition is equal to or greater than 50% by volume and equal to or less than 90% by volume. The proportion of the second filler (B2) relative to the total solid content in the resin composition is equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.
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