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公开(公告)号:US11814502B2
公开(公告)日:2023-11-14
申请号:US17771079
申请日:2020-10-21
Inventor: Akihiro Yamauchi , Eiichiro Saito , Nobuo Shibata , Kouichi Aoki
CPC classification number: C08K3/26 , C08J5/249 , C08K3/22 , C08K9/06 , C08L63/00 , C08J2363/00 , C08K2003/2227 , C08K2003/267 , C08K2201/003 , C08K2201/005 , C08K2201/006
Abstract: A resin composition contains a thermosetting resin (A) and an inorganic filler (B). The inorganic filler (B) includes: a first filler (B1); and a second filler (B2) of a nanometer scale having a smaller particle size than the first filler (B1). The first filler (B1) includes an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2). The proportion of the first filler (B1) relative to a total solid content in the resin composition is equal to or greater than 50% by volume and equal to or less than 90% by volume. The proportion of the second filler (B2) relative to the total solid content in the resin composition is equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.
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公开(公告)号:US11617261B2
公开(公告)日:2023-03-28
申请号:US17050624
申请日:2019-04-22
Inventor: Akihiro Yamauchi , Eiichiro Saito , Kouichi Aoki
IPC: B32B15/08 , C08J5/24 , B32B15/20 , C08K3/26 , C08K3/22 , H05K1/03 , C08L63/00 , H01L23/373 , H05K7/20
Abstract: A resin composition includes: a resin as Component (A); and an inorganic filler as Component (B). The Component (B) includes anhydrous magnesium carbonate as Component (b1) and aluminum oxide as Component (b2). Content of the Component (b1) falls within a range from 35% by volume to 65% by volume relative to 100% by volume of the Components (b1) and (b2) combined. Content of the Component (B) falls within a range from 60% by volume to 75% by volume relative to 100% by volume of the resin composition.
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公开(公告)号:US12006433B2
公开(公告)日:2024-06-11
申请号:US17426917
申请日:2020-01-30
Inventor: Kouichi Aoki , Tomoyuki Aoki , Eiichiro Saito
IPC: C08L71/12 , C08F255/06 , C08F283/08 , H05K3/02 , H05K3/46
CPC classification number: C08L71/126 , C08F255/06 , C08F283/08 , C08L2201/02 , C08L2205/035 , H05K3/022 , H05K3/4611 , H05K3/4673 , H05K2201/0195 , C08L71/126 , C08L23/16 , C08L25/10 , C08K3/36 , C08K5/49 , C08F255/06 , C08F226/06 , C08F283/08 , C08F226/06 , C08F283/08 , C08F222/103 , C08F283/08 , C08F212/34 , C08F255/06 , C08F212/34 , C08F255/06 , C08F210/16 , C08F283/08 , C08F210/16 , C08F283/08 , C08F220/1811 , C08F255/06 , C08F220/1811
Abstract: The thermosetting resin composition contains a radical polymerizable unsaturated compound and an organic radical compound.
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