公开(公告)号：US11814502B2

公开(公告)日：2023-11-14

申请号：US17771079

申请日：2020-10-21

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Akihiro Yamauchi ,  Eiichiro Saito ,  Nobuo Shibata ,  Kouichi Aoki

IPC: C08K3/26 ,  C08J5/24 ,  C08K3/22 ,  C08K9/06 ,  C08L63/00

CPC classification number: C08K3/26 ,  C08J5/249 ,  C08K3/22 ,  C08K9/06 ,  C08L63/00 ,  C08J2363/00 ,  C08K2003/2227 ,  C08K2003/267 ,  C08K2201/003 ,  C08K2201/005 ,  C08K2201/006

Abstract: A resin composition contains a thermosetting resin (A) and an inorganic filler (B). The inorganic filler (B) includes: a first filler (B1); and a second filler (B2) of a nanometer scale having a smaller particle size than the first filler (B1). The first filler (B1) includes an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2). The proportion of the first filler (B1) relative to a total solid content in the resin composition is equal to or greater than 50% by volume and equal to or less than 90% by volume. The proportion of the second filler (B2) relative to the total solid content in the resin composition is equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.