Invention Grant
- Patent Title: Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact
-
Application No.: US16719222Application Date: 2019-12-18
-
Publication No.: US11824116B2Publication Date: 2023-11-21
- Inventor: Biswajeet Guha , William Hsu , Chung-Hsun Lin , Kinyip Phoa , Oleg Golonzka , Ayan Kar , Nicholas Thomson , Benjamin Orr , Nathan Jack , Kalyan Kolluru , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/06 ; H01L29/417

Abstract:
Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires above a first fin. A channel region of the first vertical arrangement of horizontal nanowires is electrically coupled to the first fin by a semiconductor material layer directly between the first vertical arrangement of horizontal nanowires and the first fin. A first gate stack is over the first vertical arrangement of horizontal nanowires. A second vertical arrangement of horizontal nanowires is above a second fin. A channel region of the second vertical arrangement of horizontal nanowires is electrically isolated from the second fin. A second gate stack is over the second vertical arrangement of horizontal nanowires.
Public/Granted literature
Information query
IPC分类: