Invention Grant
- Patent Title: Broadband plasma processing systems and methods
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Application No.: US17498063Application Date: 2021-10-11
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Publication No.: US11830709B2Publication Date: 2023-11-28
- Inventor: Jianping Zhao , Peter Ventzek
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Slater Matsil, LLP
- The original application number of the division: US16572708 2019.09.17
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/66

Abstract:
An exemplary plasma processing system includes a plasma processing chamber, an electrode for powering plasma in the plasma processing chamber, a tunable radio frequency (RF) signal generator configured to output a first signal at a first frequency and a second signal at a second frequency. The second frequency is at least 1.1 times the first frequency. The system includes a broadband power amplifier coupled to the tunable RF signal generator, the first frequency and the second frequency being within an operating frequency range of the broadband power amplifier. The output of the broadband power amplifier is coupled to the electrode. The broadband power amplifier is configured to supply, at the output, first power at the first frequency and second power at the second frequency.
Public/Granted literature
- US20220028659A1 Broadband Plasma Processing Systems and Methods Public/Granted day:2022-01-27
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