- Patent Title: Power delivery for embedded bridge die utilizing trench structures
-
Application No.: US18089542Application Date: 2022-12-27
-
Publication No.: US11837549B2Publication Date: 2023-12-05
- Inventor: Kemal Aygun , Zhiguo Qian , Jianyong Xie
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt. P.C.
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L23/31 ; H01L23/498 ; H01L23/522 ; H01L23/532 ; H01L23/48 ; H01L23/00
Abstract:
Methods/structures of joining package structures are described. Those methods/structures may include a die disposed on a surface of a substrate, an interconnect bridge embedded in the substrate, and at least one vertical interconnect structure disposed through a portion of the interconnect bridge, wherein the at least one vertical interconnect structure is electrically and physically coupled to the die.
Public/Granted literature
- US20230138168A1 POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES Public/Granted day:2023-05-04
Information query
IPC分类:
