Invention Grant
- Patent Title: Solder material and method for die attachment
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Application No.: US16612883Application Date: 2018-05-11
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Publication No.: US11842974B2Publication Date: 2023-12-12
- Inventor: Angelo Gulino , Bogdan Bankiewicz , Oscar Khaselev , Anna Lifton , Michael T. Marczi , Girard Sidone , Paul Salerno , Paul J. Koep
- Applicant: Alpha Assembly Solutions Inc.
- Applicant Address: US CT Waterbury
- Assignee: Alpha Assembly Solutions Inc.
- Current Assignee: Alpha Assembly Solutions Inc.
- Current Assignee Address: US CT Waterbury
- Agency: Stinson LLP
- International Application: PCT/US2018/032325 2018.05.11
- International Announcement: WO2018/209237A 2018.11.15
- Date entered country: 2019-11-12
- Main IPC: H01L23/00
- IPC: H01L23/00 ; B23K35/26 ; B23K35/30 ; C22C13/00 ; B23K101/42
Abstract:
A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
Information query
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